Semiconductor Packaging Mechanical Design Engineer (TCB / Die Handling)- YZ11

Position title: Mechanical Design Engineer / Senior Mechanical Design Engineer

Location: Admiralty

Working Days:  5 Day A Week

Working hours: 9:00am - 6:00pm

Salary: SGD 6,000 – SGD 9,000/month (Based on experience and technical capability).

Responsibilities

Design mechanical systems and modules for TCB, flip-chip, die-bonding, and advanced semiconductor packaging equipment.

Develop mechanical concepts, 3D models, detailed drawings, assembly drawings, BOMs, and technical documentation.

Design equipment modules such as:Wafer handling systemsSubstrate, strip, panel, or glass-panel handling systemsDie ejection, die pickup, and die transfer mechanismsPrecision XY, XYZ, XYZT, and multi-axis positioning stagesBondheads and thermal bondheadsMicro-Z, force-control, compliance, and tip-tilt mechanismsHeating, cooling, vacuum, gas, and thermal isolation structuresConversion kits, change parts, fixtures, tooling, nests, and bond tools

Select suitable mechanical and motion components, including bearings, linear guides, motors, encoders, actuators, load cells, heaters, sensors, springs, and flexures.

Conduct tolerance stack-up and design reviews for critical precision assemblies.

Consider positioning accuracy, repeatability, structural stiffness, vibration, thermal expansion, force transmission, alignment, and serviceability in the design.

Work closely with process, electrical, software, vision, motion-control, manufacturing, procurement, and service teams.

Support machine assembly, alignment, integration, testing, troubleshooting, and customer qualification.

Investigate machine problems and implement practical design improvements.

Improve existing modules for better accuracy, reliability, cycle time, manufacturability, and cost.

Maintain proper engineering documentation and design-change records.

Requirements

Diploma or bachelor’s degree in Mechanical Engineering, Mechatronics, Precision Engineering, Automation, or a related discipline.

Approximately  2 or more years of mechanical design experience  in semiconductor equipment, precision automation, machine building, motion systems, or related industries.

Proficiency in 3D mechanical CAD software such as Creo, SolidWorks, Inventor, CATIA, NX, or equivalent.

Able to prepare detailed manufacturing and assembly drawings.

Good understanding of:

• Fits and tolerances
• GD&T
• Bearings and linear-motion components
• Machining and fabrication processes
• Material selection and surface treatment
• Mechanical assembly and alignment

Able to develop practical mechanism concepts rather than only produce drawings from instructions.

Willing to support machine assembly, debugging, testing, and continuous improvement.

Experience in semiconductor packaging or semiconductor automation equipment.

Experience designing precision, high-stiffness, or thermally stable machine modules.

Knowledge of thermal expansion, heater integration, thermal isolation, and temperature uniformity.

Experience with precision motion, force control, vacuum systems, pneumatics, or cleanroom-compatible equipment.

Experience with tolerance analysis, FEA, thermal simulation, or structural analysis.

Experience taking a module from concept through assembly, testing, and customer acceptance.

Familiarity with DFM, DFA, cost reduction, and engineering change control.

Experience with prototype, customised, or first-of-a-kind equipment development.

Tan Yen Zhen (Chen Yan Zhen) Reg No: R25138932

The SupremeHR Advisory Pte Ltd EA No: 14C7279