Process Technician (Dicing/Mask Alignment)

Key Responsibilities:

Operate wafer dicing machines to cut wafers into individual dies according to specifications

Perform mask alignment processes using mask aligner equipment for photolithography

Load and unload wafers, masks, and related materials safely and accurately

Set up machine parameters (alignment, cutting depth, speed, exposure settings, etc.)

Conduct routine inspection of wafers and dies to ensure quality standards are met

Monitor process performance and report any abnormalities or defects

Perform basic troubleshooting and preventive maintenance on equipment

Maintain cleanroom discipline and comply with EHS (Environment, Health & Safety) requirements

Record production data, process parameters, and inspection results accurately

Support engineers in process improvement and yield enhancement activities

Requirements

Diploma / NITEC in Engineering, Semiconductor Technology, or related field

Minimum 1–3 years of experience in semiconductor manufacturing (dicing or photolithography preferred)

Familiar with dicing saw and mask aligner equipment

Ability to read and follow technical work instructions and drawings

Basic understanding of cleanroom protocols and wafer handling

Good attention to detail and quality awareness

Able to work in a cleanroom environment and shift work (if required)