Associate Engineer (Sputter / Photolithography / Descum)
Gefragte Skills
Stellenbeschreibung
Responsibilities;
Line sustaining for dry process (i.e. Sputter, Photolithography and Descum)
Support lot dispositions and OCAP executions
Involve in Continuous Improvement Projects
Working with QM Dept. to response customer inquires and issues
Execute CIP or project handling that contributes yield & cost efficiency improvement
Ensure SPC is maintain and in control
Support new material evaluation and new tool set up
Requirements;
Diploma in electronics or related disciplines
Preferably with minimum 2 years' experience in Wafer bumping process running high volume
Knowledge in: Statistic Process Control (SPC), Out Of Control Procedure (OCAP)
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