Senior Manager, HBM Customer Integration & System Engineering

Key Responsibilities

Lead and develop teams responsible for customer integration, technical engagement, and system engineering.

Drive customer technical interlocks, design reviews, escalations, and integration activities.

Partner with design, product, manufacturing, and system engineering teams to translate customer requirements into product solutions.

Provide leadership in HBM architecture, system integration, packaging, manufacturing, and customer enablement.

Establish scalable engagement models, governance processes, and executive communications that enable successful customer deployment and qualification.

Drive resolution of complex technical issues while influencing future product and technology roadmaps.

Develops and deploys AI (artificial intelligence) systems that help automate processes and solve technical challenges.

Qualifications

BS/MS in Electrical Engineering, Computer Engineering, or related field.

10+ years of semiconductor engineering, system integration, customer-facing technical leadership, or engineering management experience

Strong understanding of HBM architecture, system integration, packaging, manufacturing processes, and customer qualification.

Proven ability to lead global cross-functional teams and influence executive-level stakeholders and customers.

Excellent communication, leadership, and problem-solving skills

Preferred Experience

Customer-facing leadership experience with hyperscale, AI, networking, or semiconductor customers.

Experience leading geographically distributed teams across Asia and the United States.

Knowledge of advanced memory solutions, AI systems, and high-performance computing platforms.